Explore Amphenol Solutions at DesignCon 2021
Engineers around the world are eager to gather to discuss hot topics and new innovations in the electronics industry at DesignCon 2021, August 16th-18th, 2021 at the San Jose McEnery Convention Center. Decision makers will be able to learn about the wide range of Amphenol’s industry-leading connectivity solutions that are enabling the electronics revolution.
High Speed IO Solutions
Amphenol’s High Speed IO products offer customers a complete end to end solution for every application. Our HSIO connector, copper cable, and active optical cable solutions include 100G/200G/400G QSFP, DSFP, 300G CXP2 AOC, 50G/100G/200G/400G SFP, Mini-SAS HD AOC, and our External High Speed IO OverPass™ solutions. Our latest QSFP DD and OSFP interconnect product families support up to 25 Gb/s NRZ or 56 Gb/s PAM4 for up to 800G aggregated bandwidth.
Our transceivers round out our full suite of IO interconnect products. We have the complete interconnect solution for your system design with our portfolio of optical products from 1G-400G across different form factors from SFP to QSFP DD to Fibre Channel. We support multiple standards from BIDI to LWDM. You can view our wide array of 25G, 32G, 50G, 64G, 100G, and 400G products at DesignCon.
High Speed Backplane Solutions
Amphenol is the leader in high-speed, high-density connection systems, designing and manufacturing the industry's leading connectors and backplane systems. We solve system design challenges with integrated interconnect solutions for applications in the networking, communications, storage, and computer server markets.
Our newest High Speed Backplane products Paladin® Plus, Paladin® HD, ExaMAX+®, ExaMAX 2®, and XCede® HD2 offer game-changing connector and cable solutions with speeds ranging from 12G to beyond 112G PAM4. We’ll also be highlighting our Cabled Backplane OverPass™ solutions.
Mezzanine Products
Our specialization in high-speed and high-density can also be found in the board-to-board mezzanine arena. The product range is enhanced with SMT, Ball Grid Array (BGA), Press-fit and Compression technology. We’ll be showcasing our mezzanine products Lynx™ QD, cLGA® and cStack™, and cStack™ and Custom Flex, TR Multicoax, CA Connectors and Interposers, SK Sockets, micro-LinkOVER™, and our Internal OverPass™ solutions.
Power Solutions
For the past 20 years, Amphenol’s power connectors have been leading the way in technology innovations around the world. We have power connectors up to 300A per contact, with our most popular products including PwrBlade®, PwrMAX®, and BarKlip® IO families. Whether your power need is in Commercial, Energy Management, Servers, Networking/Telecommunications, Data Centers, or Industry 4.0, Amphenol has a solution for you.
FCI Basics Connections
Versatile features are an added advantage to high-speed performance. FCI Basics solutions include Signal & Mid Power Wire-to-Board, Board-to-Board, Input/Output, FFC/FPC and Backplane with a wide range of pitch sizes extending from 0.21mm to 5.70mm, providing you with the most versatile connector solutions. Minitek MicroSpaceXS™, Minitek® MicroSpeed, FlexLock™, WireLock®, ComboStak® and PowerStak®, and BergStak® are featured at DesignCon this year.
Storage and Server IO
We offer the widest range of high speed and high power card edge connectors to address next generation enterprise storage and server applications. Designed for high speed signals and power in space saving formats, we will be highlighting the Double Density Cool Edge, Slim Cool Edge and 112G Mini Cool Edge product families. We will also present the latest PCIe CEM Gen4 and 5, M.2 PCIe Gen4 and 5, DDR4, and DDR5 connectors. 24G or 32GT/s SAS PCIe U.2/U.3 4.0 and 5.0 will be showcased as well, supporting future solid state drives (SSD).
Commercial IO Solutions
Ranging from headers to SD card and USB Type C connectors, to Ethernet interconnect products for tomorrow’s automotive networking needs, fan connectors, and D-Subs, Commercial IO has your signal and low power interconnection requirements covered. Connectors specific to IT & Consumer, Automotive Electronics, and LAN & Industrial applications will be at the show: High-speed Automotive Ethernet connectors, Fan connectors, Industrial Ethernet connectors, USB, and Mini Micro Power Wire-to-Board.
Commercial Industrial Solutions
Providing commercial industrial solutions, our Single Pair Ethernet provides Industrial Ethernet connectivity over a single pair of wires, saving space, weight and cost in ruggedized robotics, factory and process automation. ixIndustrial™ represents the next generation of high speed, high density, ruggedized robotics and factory automation Ethernet connectivity. Meet your Modular Jack needs with the widest variety of standard, high performance and integrated magnetics. Designed to meet a wide range of requirements, check out our truly unique Harsh Environment connectors. We will also be featuring our Street and Indoor Lighting Connectors.
AssembleTech
Our offerings represent total high-speed cabling solutions for signal and power transmission. Our featured products include the ExtremePort™ and UltraPort™ families, Riser Card ODC Cable Solution, and Blind Mate Solution. Additionally, we offer MiniSAS HD, MiniSAS, SATA, DisplayPort, HDMI, DVI, USB, Waterproof, and customized WireHarness. These are all widely used in the Datacom, Consumer Electronics, Telecom, Infotainment, Embedded Computing, and Green Energy industries.
Come visit us at booth #707, San Jose McEnery Convention Center, San Jose, CA from August 17th to 18th for our product launches and demonstrations.