产品视频
Amphenol
Overview
Analysis of Direct-to-Package 224G Channels
Achieving 224Gb/s over copper interconnects presents multiple challenges.
Product Portfolio
New High Speed Backplane Products (2021)
Product Portfolio
Storage & Server IO Connectors (2021)
Product Portfolio
Storage & Server IO Connectors - Chinese (2021)
Product Portfolio
Commercial Industrial (2021)
Product Portfolio
High Speed IO & OverPass Technology (2021)
Product Portfolio
High Speed Cable Assemblies (2021)
Product Portfolio
FCI Basics High Speed Solutions (2021)
Product Portfolio
TR Multicoax, HCTF, & micro-LinkOVER (2021)
Tech Demo
Newest Gen Paladin Connector Series (2021)
Tech Demo
OSFP 112G Chip to Chip Channel Cables (2021)
Tech Demo
ExaMAX2 Cable Assembly Running at 112G (2021)
Tech Demo
Mini Cool Edge IO Cable Assembly, 112G PAM4 Signal (2021)
Tech Demo
QSFP DD & OSFP 800G Host Compliance Test Fixtures (2021)
Tech Demo
112G Mini Cool Edge Connector with MultiLane (2021)
Windowing and Rise time
What is the rise time of a system given a specific windowing function?
User Manual - Crimping Tool
Crimping tool for Minitek Microspace™ 1.27mm, 1.50mm and 1.80mm Crimp-to-Wire Connector
Zhaga Book 20
Zhaga book 20 lighting standard - the smart interface between indoor luminaires and sensors and communication modules
Single Pair Ethernet visions: AMPHENOL
Introducing the members of the SPE Industrial Partner Network: AMPHENOL
EazyPwr™ Connectors
The connector family provides fool-proof install and field termination capability
ExaMAX2 Backplane Connector
Demonstration that showcases the robustness of ExaMAX2 in all demate conditions
Lynx QD Connector
56G product demo through Lynx QD
QSFP DD OverPass and Cable Assembly Solution for 112G
112G per Lane QSFP DD and microLinkOVER with Cadence
High Speed Cable - Mini Cool Edge IO
This Cable Assembly is designed for PCIe Gen 3, 4, 5, and also being developed for 112G PAM4
Griplet® Miniature IDC Connectors
Reliable connection and ease of installation for Wire-to-Board terminations
DesignCon 2018
Amphenol WalkThrough
DesignCon 2018
Paladin 112Gbps Interconnect Channel
DesignCon 2018
112G PAM4 with Mini Cool Edge Connector with Credo Semiconductor
DesignCon 2018
32G NRZ with PCIe Gen5 Connector with MultiLane
DesignCon 2018
300Gbps Embedded Optical Transceiver
DesignCon 2018
Data Center Cabling, Active Copper
DesignCon 2018
ExaMAX+ 8 Pair DMO Connector System
DesignCon 2017
Paladin DMO Running 50G NRZ with Credo
DesignCon 2017
Paladin DMO
DesignCon 2017
ExaMAX
DesignCon 2017
ExaMAX Standard Backplane 56G PAM4
DesignCon 2017
ExaMAX Plus DMO 112G PAM4 with Credo
DesignCon 2017
ExaMAX Backplane 56G PAM4 with Credo
DesignCon 2017
ExaMAX Plus DMO 112G PAM4
DesignCon 2017
Cable Backplane
DesignCon 2017
OSFP
Millipacs® High Speed Connectors
Millipacs® is a 2.00mm modular, Board-to-board and Cable-to-board Interconnection system....
VerIO™ Connector
A versatile, robust and compact I/O system featuring multiple standard connector interfaces such as RJ45, PoE, Signal, Power and Hybrid.
Minitek Microspace™ Crimp-to-Wire Connector
Minitek MicroSpace™ Crimp-to-Wire connector platform's unique design enables LV214 Severity-2
OCTIS™ - Outdoor IO System
The versatile OCTIS™ I/O system, using multiple industry standard interfaces.
OCTIS™ - Power Cable Assembly
The OCTIS™ Power version is suitable for high power applications.
DesignCon 2016 - Highlights
DesignCon 2016 - Highlights from Amphenol FCI
Demo at DesignCon 2016
100Gb/s Active Cables & 56Gb/s Backplane Solutions with BiFast
Demo at DesignCon 2016
Power Solutions Demo
Demo at DesignCon 2016
QSFP Cable Assembly with Texas Instruments
Demo at DesignCon 2016
ExaMAX® Demo with Avago
Demo at DesignCon 2016
ExaMAX® Demo with Credo
PwrBlade+™ - Slide-to-Lock
FCI's PwrBlade+™ - Slide-to-Lock demonstration
Other Video
Amphenol FCI India
Introduction to Amphenol FCI India