ODCC Summit 2019 is just a few days away. Like previous years, Amphenol ICC is extending a wide variety of solutions in the Summit. Read on to learn more about our showcase this year.

High Speed I/O

At ODCC 2019, Amphenol ICC will showcase superior interconnect solutions like QSFP, QSFP DD, and OSFP in connector and cable versions. QSFP28 100G interconnect system increases small form factor based port bandwidth density well above existing QSFP systems. The 0.80mm QSFP DD interconnect system is an emerging high-speed double-density QSFP interface with 76-position. The high-speed high signal integrity Octal SFP (OSFP) interface, provides solutions up to 400Gb/s aggregate bandwidth with up to 56Gb/s PAM4 modulation.

High-Speed Backplane

Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD meets requirements of high-density architectures. ExaMAX®  delivers superior signal integrity performance resulting in low crosstalk noise and low insertion for higher bandwidth applications that support data rates up to 25Gb/s to 56Gb/s.

Power Solutions

High power connectors like PwrBlade® and BarKlip® serve as a de-facto standard in data centers with its high power density, ultra-low contact resistance, and overall design modularity. PwrBlade® ULTRA is a highly configurable power & signal connector, capable of carrying over 200A per linear inch while maintaining an ultra-low contact resistance of just 0.4mΩ With 14 fully independent cantilevered beams providing a true compliant spring to adjust for variations in busbar alignment and surface finish, BarKlip® BK200 I/O is a convenient method of distributing up to 200A between busbars, cables, and circuit boards.

Storage and Server IO

Amphenol ICC offers our range of industry standard storage and server connectors that future proofs next-generation systems with high speed capability and backward mating compatibility. Key products are Mini Cool Edge, SAS/PCIe 5.0, PCIe Gen 4 and Gen 5, DDR4 and DDR5.

Wire-to-Board Solutions

FCI Basics wire-to-board solutionslike Minitek® Pwr, BergStak HS™ 0.5mm and BergStak® 0.80mm connectors offer a comprehensive range and is a reliable solution for data centers requiring mid power, high density solutions.

Visit us at ODCC Booth C16 to learn more on these industry-leading solutions at Beijing International Convention Center from 3 to 4 September 2019. Don't forget to pre-register on WeChat from 2 August to 2 September 2019 to redeem an exclusive gift!