MiniStak High Density High Speed 0.6mm Board-to-Board Connector

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Amphenol has developed a product series of MiniStak high-density and high-speed board-to-board connectors on a 0.6mm pitch, performing to PCIe Gen5 SI with road map to PCIe Gen6. It supports stack heights of 5.0mm, 7.5mm, and 10.0mm. These connectors support the operating current rating at 0.5A per signal contact and 1.1A per power contact.

The product series has connector pin counts ranging from 40pos to 400pos at an increment of 40pos with road map up to 1000pos. And it is with multiple rows of BGA terminations from 4-rows to 10-rows. Withstanding up to 60 times mating cycles, these connectors are engineered for a wide range of high-reliability applications and demanding environments.

This high-density connector system saves space on the PCB and is highly suitable for high-density applications in data, embedded systems, medical, and communication markets, and is specifically designed to address the everincreasing performance demands and bandwidth needs of new and upcoming applications.

特征与优点

FEATURES	BENEFITS
Higher bandwidth up to PCIe Gen5 SI with road map to PCIe Gen6	To give an extra-long application life cycle without data transfer rates as bottlenecks
Fine pitch of 0.60mm	To allow smaller PCB estate area
Scalable pin count from 40pos to 400pos at the incremental of 40pos with road map up to 1000pos.	To accommodate a variety of design and application needs
Three stack height variations	Provide feasibility of stack height to cater to different applications
Operating current rating at 0.5A per signal contact and 1.1A per power contact (with 24 contacts energized)	Allows high current application by energizing more pins
RoHS compliant and lead-free	Meets environmental, health, and safety requirements
The connector pairs can withstand 50G mechanical shock	Allows applications in the critical working environment

MiniStak High Density High Speed 0.6mm Board-to-Board Connector