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Tag Archives: Gen Z

Amphenol at Virtual Flash Memory Summit (FMS) 2020

Amphenol at Virtual Flash Memory Summit (FMS) 2020

Flash Memory Summit (FMS), the world’s premiere flash memory conference and exposition brings together storage designers, integrators, and IT storage professionals from around the world to create the most competitive, high-performance storage solutions. Amphenol is proud to be the part of the Virtual FMS this year, taking place from November 10th to 12th 2020.

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Check Out the Latest Server Connectors at DesignCon 2020

Check Out the Latest Server Connectors at DesignCon 2020

DesignCon being the largest chip, board, and systems event in the industry witnesses the launch of many innovative products. Amphenol ICC will be is launching three high-speed server connectors at DesignCon 2020: Right Angle PCIe® Gen 4 CEM connectors, Gen Z 4C-HP Mini Cool Edge connectors and Double Density Cool Edge connectors.

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Gen Z – The Next Gen Computing Architecture

Gen Z – The Next Gen Computing Architecture

The world is demanding higher levels of computing performances. It is the need of the day to develop a system that meets the massive data requirements without compromising on the security. Gen Z is an answer to that question.

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Modern Data Center Storage Technologies

Modern Data Center Storage Technologies

The convergence and virtualization trends of modern Data Center storage are extending their scope to meet next generation requirements.  The article gives a brief on modern practices and future technologies that will meet the demands of advanced Data Center storage.

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Amphenol ICC’s Data & Communications Product Lines on Final Day of Electronica 2018

Amphenol ICC’s Data & Communications Product Lines on Final Day of Electronica 2018

As the final day of the event is approaching, here is a sneak peek in our Data and Communications showcase at Electronica 2018.

Cool Edge

Cool Edge is a high speed and high power board to board connector system addressing multiple standards like PCIe, SAS, SATA, Gen 4/5, OCP 3.0, EDSFF, NGSFF/NF1, Gen Z. It is offered in different configurations like mezzanine, coplanar, midplane and backplane, making it suitable for applications in data and communication such as S (阅读更多)