Tag Archives: ExaMAX2

Amphenol Exhibits and Demos at DesignCon 2022

2022年4月1日

DesignCon, the largest event for Chip, Board, and Systems Design Engineers, brings together the brightest talents across the world. This premier gathering has the legacy of more than two decades in solving the signal and power integrity challenges and creating innovative design solutions for tomorrow. (阅读更多)

Amphenol’s Newest High Speed Interconnect Offerings

2022年2月25日

Amphenol offers an array of high speed interconnect solutions, suitable for next generation speed and density requirements. Our extensive portfolio includes high speed backplane connectors, copper cable assemblies, loopback modules, OverPass™ solutions, optical transceivers and more. (阅读更多)

Amphenol ICC Develops 112Gb/s Interconnect Technology with eTopus Products for High Speed IP Solutions

2021年9月14日

San Jose, CA, USA – Amphenol ICC, the global leader in connector technology, design and manufacturing, and eTopus Technology, a pioneer of ultra-high-speed ADC/DSP-based SerDes for wireline applications including data center, cloud, edge, and 5G base stations, today announced the development of a 112Gb/s interconnect technology built on their products (阅读更多)