Tag Archives: ExaMAX
Amphenol ICC Develops 112Gb/s Interconnect Technology with eTopus Products for High Speed IP Solutions
San Jose, CA, USA – Amphenol ICC, the global leader in connector technology, design and manufacturing, and eTopus Technology, a pioneer of ultra-high-speed ADC/DSP-based SerDes for wireline applications including data center, cloud, edge, and 5G base stations, today announced the development of a 112Gb/s interconnect technology built on their products
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Explore Amphenol Solutions at DesignCon 2021
Engineers around the world are eager to gather to discuss hot topics and new innovations in the electronics industry at DesignCon 2021, August 16th-18th, 2021 at the San Jose McEnery Convention Center. Decision makers will be able to learn about the wide range of Amphenol’s industry-leading connectivity solutions that are enabling the electronics revolution.
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Come Visit Us at DesignCon 2021
DesignCon, North America's largest chip, board, and systems event is returning to Silicon Valley for its 26th year. It continues to be the premier educational conference and technology exhibition for high-speed communications and semiconductor industries.
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112G for Quickest Data Transfer
Data usage is increasing every year, and the communications industry is working diligently to support the increased demand. This article discusses why we need more data, what data center physical layer architecture changes are needed to support higher data rates, and how Amphenol is well positioned to support higher data rate systems.
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Amphenol ICC New Products Updates
Amphenol has always marked its place in the market by introducing innovations a step ahead. Besides being keen in bringing novel products to meet the demands of progressive applications, we always have maintained a range of legacy product brands that stand tall among others. BergStak®, Minitek®, and ExaMAX+® are a few such popular brands. This article discusses the newest additions to these families.
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