Tag Archives: Double Density Cool Edge Connectors
Amphenol at Virtual Flash Memory Summit (FMS) 2020
Flash Memory Summit (FMS), the world’s premiere flash memory conference and exposition brings together storage designers, integrators, and IT storage professionals from around the world to create the most competitive, high-performance storage solutions. Amphenol is proud to be the part of the Virtual FMS this year, taking place from November 10th to 12th 2020.
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Growth and Trends of Solid State Drives (SSDs)
The significance of super-fast storage systems is escalating with the progress in big data and IoT. The coming years are focusing on developing high capacity SSDs at a lower cost. We have earlier discussed researches and advancements happening with SSDs that are set to meet the enhanced application demands.
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Check Out the Latest Server Connectors at DesignCon 2020
DesignCon being the largest chip, board, and systems event in the industry witnesses the launch of many innovative products. Amphenol ICC will be is launching three high-speed server connectors at DesignCon 2020: Right Angle PCIe® Gen 4 CEM connectors, Gen Z 4C-HP Mini Cool Edge connectors and Double Density Cool Edge connectors.
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Amphenol ICC New Products Updates – August 2019
Three high-speed products were introduced to the Amphenol ICC product portfolio in the month of August. Double Density Cool Edge Connectors and BergStak® FX10 offers high-speed high-density board to board solutions and the microSD Express Connector uses PCI express 4.0 protocol rated up to 16Gb/s making it a high-performance memory card connector compliant to SD specification V7.1
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