Tag Archives: CSTACK FLEX

Flexible & Reliable Solution for Compact Applications

2018年6月28日

Mezzanine interconnect systems have served several industries, applications, and technological developments. Amphenol ICC has always provided the right solution that ensures high reliability and operation speed with design flexibility in limited space. With a broad range of mezzanine solutions meeting varied application needs, we offer an accessible path to innovation.

In addition to the wide range of high speed and high-density mezzanine connectors, flex assemblies solve several chal (阅读更多)

cLGA- The Highly Adaptive Compression Solution

2018年4月30日

Advanced electronic applications are in constant need of next-generation chip-to-board, flex-to-board, and board-to-board interconnection technology. From applications that require improved thermal performance and high-speed performance to latest semiconductors, various technologies trust the integrated design features of the cLGA packages.

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