每月档案:July 2021

Types of Memory Modules and Their Applications

2021年7月26日

Memory modules can be defined as PCBs mounted with integrated-circuit-based memory. These are used in various computing applications ranging from notebooks and laptops to servers and data center. Memory module standards have evolved over generations to meet the growing demands of high-speed, data-hungry applications. (阅读更多)

Come Visit Us at DesignCon 2021

2021年7月19日

DesignCon, North America's largest chip, board, and systems event is returning to Silicon Valley for its 26th year. It continues to be the premier educational conference and technology exhibition for high-speed communications and semiconductor industries. (阅读更多)

Mini Cool Edge IO Connectors for 5G and Datacenters

2021年7月12日

With 5G on the spotlight and IoT or the Internet of Things making everyday life smarter, the demand for integrated technology is on a constant rise. When innovations are made a reality, it is critical to create robust architectures with reliable interconnect support to meet the demands of modern applications. The impulse of the digitalized world is largely dependent on the speed and efficacy of data transfer. (阅读更多)

Modular Jack Connectors and Their Applications

2021年7月5日

The invention of modular jacks is considered to be a significant event in the history of communications connectors. Originally introduced in the 1970’s, modular jacks were first used to facilitate the growing complexity of telephone systems in North America. Prior to the arrival of modular jacks, telephones were typically hardwired to the building network wiring, or made use of much bulkier connectors. (阅读更多)