每月档案:March 2019
Direct Orthogonal Architecture: Signal Speed Benefits, Mechanical Risks and Solutions
System designers are encountering new architectural challenges as single lane data rates are continuing to increase. Next generation SerDes devices d, will soon be scaling to 112Gbps PAM4. A major obstacle in system design is the challenge of passing 112Gb/s high frequency signals through PCB without loss.
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5G Wireless - En route to Smart Life
Life gets smart, quick and easy with 5G connectivity. This new generation of technology will pave the way for substantial innovations that influence many areas of life. 5G will deliver data promptly and seamlessly compared to the previous versions. Machine to machine communication and automation of various machines will leap to the next level.
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Powering the Electronics Revolution at APEC 2019
APEC is one of the premier events in applied power electronics that brings together more than 45,000 professionals from around the world for networking, hands-on learning, and strategic business development. APEC focuses on the practical and applied aspects of the power electronics business.
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Amphenol ICC Industrial & Automotive Showcases at Electronica China
Amphenol ICC has a broad array of innovative technology and solutions to support Industry 4.0 and the Automotive industry. Come see the star products in our Industrial and Automotive showcase:
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OCTIS enabling 5G connectivity
Deployment of 4G+, LTE+ and the evolving 5G in the Telecom market is requiring more sophisticated outdoor IO solutions and higher capacities and efficiencies. With the introduction of 5G, the telecom industry should be equipped enough to provide sufficient infrastructure and facilities to carry the high-speed signal with a latency value as small as 1ms or less.
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