OverPass™
High Speed Bulk Cables
OverPass™
External IO
The OverPass cable assembly portfolio is enhanced by the use of Amphenol Spectra-Strip’s high frequency SkewClear EXD cable technology and manufacturing expertise.
- offerings include multi-pair cables: 2,4 and 8 pair constructions in wire gages from 32 AWG to 26 AWG
- feature FEP insulated wiring for the higher temperature environments that OverPass products can be exposed to while minimizing associated signal loss
- support transmission speeds of 10G, 28G and 56G PAM 4 per lane bandwidths (112G versions in development)
Spectra-Strip engineers work closely with their Amphenol IO connector counterparts assuring our customers the lowest total applied interconnect link cost for their OverPass cable assembly applications.
SkewClear® EXD™ Gen 1
Two insulated cores, shielded longitudinally
- Proven production model
- OverPass compatible today
- Available for immediate OverPass link / concept evaluation
Compatibility Roadmap
- 112G
- Currently compatible with ExaMAX2, Paladin, micro-LinkOVER, Densilink, QSFP DD, and OSFP
SkewClear® EXD™ Gen 2 (2 extrusion)
Two insulated cores encapsulated in a secondary insulation, shielded longitudinally
- Closely coupled conductors reduce wire mode conversion
- Foam insulated cores possible to extend reach / density
- OverPass in development
- Longest reach links away from high heat sources (<85°C)
Compatibility Roadmap
- 112G
- Planned compatibility with ExaMAX2 and Paladin on longest reaches
- 224G
- Planned compatibility (in development) with ExaMAX2 and Paladin on longest reaches
SkewClear® EXD™ Gen 2 (1 extrusion)
Two conductors encapsulated in a single insulation, shielded longitudinally
- Closely coupled conductors reduce wire mode conversion
- Customizable profiles possible
- OverPass in development
- High performance near chip applications
Compatibility Roadmap
- 112G
- Planned compatibility (Q421) with micro-LinkOVER, Paladin, QSFP DD, OSFP, and DensiLink
- 224G
- Planned compatibility (in development) with micro-LinkOVER, DensiLink, ExaMAX2, Paladin, and OSFP