Advanced electronic applications are in constant need of next-generation chip-to-board, flex-to-board, and board-to-board interconnection technology. From applications that require improved thermal performance and high-speed performance to latest semiconductors, various technologies trust the integrated design features of the cLGA packages.

The cLGA Land Grid Array socket system is a low cost, high signal integrity, and high reliability offering from the Amphenol ICC family to bring conventional connector material construction to high-performance chip-to-board applications. The system guarantees long-term connector performance, contact retention, and ruggedness in handling and use, with its Gold over nickel-plated beryllium copper spring contacts. These are highly reliable for applications that require high speed and performance, with minimum space requirements.

The contacts are grouped into three categories by stack height; - Standard 1.22 mm, Shunted 1.22 mm to 1.55 mm and Tall 2.75 mm to 6.5 mm for applications that require greater height and compliance.

Cstack board-to-board or flex circuit-to-board stacking connectors from Amphenol ICC is yet another low cost, high signal integrity solderless alternative to standard two-piece connectors that use cLGA technology. An even more flexible version of this, cStack Flex is on the market today to meet unique signal integrity, mechanical, power, and environmental requirements.

cStack Flex is a compression based interconnect utilizing Amphenol's cStack interposer, terminated to a multi-layer impedance-controlled flexible circuit in a compact footprint.

The product is on the market ever since 2001 and has already shipped over 1 billion contacts to serve multiple industries. Engineers can create custom designs for specific application requirements or utilize standard frames for cost-effective solutions.