112G High Speed Solutions
AMPHENOL'S GAME CHANGING 112Gb/s INTERCONNECT TECHNOLOGY.
Amphenol understands how to provide connector solutions to enable the higher speeds of today. We have the tools and expertise to help our customers get there, electrically and mechanically – and every type of connector needed for 112G integration.
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112G State of the Union
IEEE and OIF are leading the drive to higher data rates, and other standards organizations are looking to them for guidance to transition to higher data rates. Channel definitions for 112Gb/s criteria are finishing up and 224Gb/s is on the far horizon. The 112Gb/s channel definition for backplane, mezzanine, and within chip architectures are all approved. The chip-to-chip and chip-to-module applications are still being refined, but are near completion.
Standards
The industry defines a working 112Gb/s channel within these standards. A channel is comprised of the SERDES transmission and receive impairments, the SERDES board attach geometry, and all the physical connections between commonly called a link. The pieces of each link are unique for each architecture. A backplane, for example, is three sets PCB traces connected with two connector systems.
What constitutes a 112G solution?
If a component is shown to work within a given channel, it is a valid solution for 112Gb/s application. Amphenol has 112Gb/s connector solution for every application that requires a connector. Paladin® and ExaMAX® are used for mezzanine and traditional, cabled, and orthogonal backplane. Amphenol SFP, SFP DD, QSFP, QSFP DD, and OSFP connectors and cable are available for 112Gb/s applications. We also have solutions for more niche applications. For example, Mini Cool Edge and Swift support 112Gb/s channels with card edge interconnectivity.
IEEE and OIF are leading the drive to higher data rates, and other standards organizations are looking to them for guidance to transition to higher data rates. Channel definitions for 112Gb/s criteria are finishing up and 224Gb/s is on the far horizon. The 112Gb/s channel definition for backplane, mezzanine, and within chip architectures are all approved. The chip-to-chip and chip-to-module applications are still being refined, but are near completion.
Standards
The industry defines a working 112Gb/s channel within these standards. A channel is comprised of the SERDES transmission and receive impairments, the SERDES board attach geometry, and all the physical connections between commonly called a link. The pieces of each link are unique for each architecture. A backplane, for example, is three sets PCB traces connected with two connector systems.
What constitutes a 112G solution?
If a component is shown to work within a given channel, it is a valid solution for 112Gb/s application. Amphenol has 112Gb/s connector solution for every application that requires a connector. Paladin® and ExaMAX® are used for mezzanine and traditional, cabled, and orthogonal backplane. Amphenol SFP, SFP DD, QSFP, QSFP DD, and OSFP connectors and cable are available for 112Gb/s applications. We also have solutions for more niche applications. For example, Mini Cool Edge and Swift support 112Gb/s channels with card edge interconnectivity.
High Speed IO
Featured Products
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OverPass™ External High Speed IONear ASIC to External High Speed IO receptacles -
OverPass™ InternalNear ASIC to cards or boards located within a system -
QSFP28/56/112G Cable AssembliesAmphenol's QSFP28/56/112G cable assembly is designed to meet data center, networking and high performance computing application. -
ExtremePort™ QSFP DD 112G ConnectorsAmphenol's ExtremePort™ QSFP DD 112G interconnect system is comprised of a 76 position, 0.8mm pitch connector built for use in high-speed serial applications. -
QSFP DD Copper Cable Assemblies 200G/400G/800GAmphenol's QSFP DD (Double Density) passive copper cable assemblies originally doubled the number of 25G/lane. -
ExtremePort™ OSFP 112G ConnectorsAmphenol's ExtremePort™ OSFP 112G interconnect system is comprised of a 60 position, 0.60mm pitch connector designed for high-speed serial applications. Each port supports up to 800Gb/s in aggregate over an 8 x 112Gb/s electrical interface. -
OSFPAmphenol's OSFP interconnect system has 60 contacts per port, with a 0.6mm contact pitch and 8 high speed channels. The OSFP footprint is optimized for signal integrity. -
OSFP Copper Cable Assemblies 200G/400G/800GAmphenol's leading the industry in OSFP cable development. Our Electronics Products 'Product of the Year' award-winning OSFP (Octal Small Form Factor Pluggable) cable assemblies are compatible with 25G/lane channel NRZ up to 112G/lane channel PAM4 signaling protocols that allow the cables to deliver aggregate bandwidths of 200G, 400G, and 800G per cable assembly. -
ExtremePort™ SFP112GAmphenol's ExtremePort™ SFP112G interconnect system is comprised of a 20-position hot swappable I/O connector enclosed in a metal cage mounted to a host PCB. -
ExtremePort™ Flash ConnectorAmphenol introduces the next-generation OverPass™ solution - ExtremePort™ Flash. The 0.60mm pitch connector comes with an extreme low profile design capable of transmitting high-speed signal up to 56G PAM4, and allows much greater signal path lengths, while maintaining SI performance when compared to conventional PCB routing methods. -
micro-LinkOVER™micro-LinkOVER™ is an above PCB twinaxial connector system that provides system designers and layout engineers a cost effective approach to unlock the design flexibility needed to manage the technical challenges of PAM4 56G and 112G systems and beyond. -
DensiLink®DensiLink® OverPass™ products remove high speed signaling from the PCB and create a double ended, high performance cabling interconnect. These cables support 56G and 112G signaling in hardware system designs as well as technology for future 224G signaling systems. -
High Speed IO - CablesFull range of high speed cables
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High Speed IO - ConnectorsFull range of high speed connectors
High Speed Backplane
Featured Products
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OverPass™ - Cabled BackplaneNear ASIC to system backplane or coplanar cards -
Paladin®Paladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects. Exhibiting smooth linear transmission beyond 40GHz. -
Paladin® HDThe Paladin® HD interconnect system provides world class bandwidth through industry leading density at 112GB/s performance. -
ExaMAX2®The ExaMAX2® backplane connector system supports 112Gb/s PAM4 industry specifications. -
Cabled Backplane
Mezzanine
Featured Products
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Paladin®Paladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects.
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ExaMAX2®The ExaMAX2® backplane connector system supports 112Gb/s PAM4 industry specifications.
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112G High Speed Solutions
Resources
It’s Time For an Upgrade. What do we need to do?
Data usage is increasing every year, and the communications industry is working diligently to support
the increased demand. This article discusses why we need more data, what data center physical layer architecture changes
are needed to support higher data rates, and how Amphenol is well positioned to support your higher data rate systems.
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Amphenol’s 10G+ High Speed Solutions
If you’re looking for something other than 112G, reference Amphenol’s full range of High Speed Products, from 10Gb/s and up